Manufacturing and Process Standards (Specifications for "Producing Chips That Are 'Capable and Qualified'")Domestic: GJB 548B-2005 (Specification for Military Semiconductor Devices,对标 MIL-STD-883)， GB/T 2423 (Civilian Chip Environmental Reliability Testing， such as high and low temperature， humidity cycling tests).

Testing and compliance standards (the regulations for "qualified production and legal listing" of chips)
Covering tests on chip performance, security, environmental protection, etc., they are essential conditions for chip mass production and export.
Performance and function testing standards
International: JEDEC's chip performance testing specifications (such as read and write speed tests for DDR memory chips), IEEE's chip logic function testing standards.
Domestic: GB/T 39230-2020 (Semiconductor Chip Performance Testing Methods), SJ/T 11774-2018 (Chip Logic Function Testing Specifications).
Security and compliance standards
International: CE (EU chip compliance certification, covering electromagnetic compatibility EMC, safety), FCC (US electromagnetic compatibility certification), RoHS (EU environmental standard, restricting harmful substances such as lead and cadmium in chips).
Domestic: CCC (Compulsory Product Certification, civilian chips such as USB chips, display chips need to pass), CQC (Voluntary Certification, industrial chips), GB/T 9254-2022 (Electromagnetic Compatibility Standard,对标 CE/FCC).
Data security standards (essential for new chips)
International： ISO/IEC 15408 (Chip Information Security Evaluation， i.e. CC Certification).
Domestic： GB/T 35273-2020 (Personal Information Security Technology - Chip-level Protection Requirements)， applicable to mobile phones， payment chips， requiring encryption and tamper-proof functions.