Full-process delivery acceleration: Efficient closed-loop from order to delivery

Relying on digital control and process optimization, the batch delivery cycle has been compressed to the industry-leading level, achieving the commitment of "fast and accurate" delivery:

Order response and production acceleration: Establish a 24-hour order review mechanism. For regular batch orders, the process plan confirmation and production scheduling are completed within 48 hours. Through pre-optimization of DFM (Design for Manufacturing), the conversion period from trial production to mass production is shortened to 12 weeks, which is 30% faster than the industry average. For mature process chips, the "45-day rapid delivery" standard is achieved, with the batch delivery cycle of automotive-grade PMIC chips being able to be compressed to 35 days, meeting the urgent order replenishment needs of the automotive industry.

Test and packaging efficiency upgrade: Adopt parallel testing technology, reducing the time for single batch wafer electrical testing (CP) from 8 hours to 3 hours, while maintaining a test coverage rate of over 99.5%; introducing an automated production line in the packaging process, improving the efficiency of soldering, bonding, etc., by 50%, and the daily production capacity of a single packaging line exceeds 500,000 pieces. For high-end products such as AI chips, customized test solutions achieve "test - sort - packaging" integration, reducing the batch delivery cycle from the industry's regular 60 days to 40 days.